Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly
(1998)
Thesis
He, D. Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly. (Thesis). University of Salford
One of the main challenges facing the electronics manufacturing industry in solder paste printing for ultra-fine pitch surface mount and flip-chip assembly is the difficulty in achieving consistent paste deposit volumes from pad-to-pad. At the very... Read More about Modelling and computer simulation of the behaviour of solder paste in stencil printing for surface mount assembly.