An investigation into ion plating mechanisms and parameters

Delcea, BL

Abstract

Ion plating is a fairly new and modern technique for
obtaining very adhesive films on any kind of surface and
substrate material. The development of electron gun evaporation sources created the possibility to deposit, with high rates, materials having high melting points like : Molybdenum, Tungsten and even Carbon.
A part of this work attempts to establish the kind of
particles which are involved in ion plating, especially the
energetic neutrals that have been considered not to play a
major role in the coating process.
For this purpose, the ions are separated from the neutrals
and their energy spectrums determined using theoretical
and experimental methods. The influence of process parameters upon the energies of the ions and neutrals is also studied.
Another part of this work is a parametric study of
the nucleation of ion plated thin films as compared to
the straight vacuum evaporated ones. The film-substrate
interface of ion plated films is also analysed and measured
attempting to clarify the processes that lead to the
formation of a deep grossed interface.
Finally a parametric study is carried out with the aim of producing improved film structures in a controlled
manner by varying the main process parameters such as :
pressure, bias voltage and ion current. The substrate
temperature is also considered. A physical model for removing the columnar structure is produced snd reported.

Citation

Delcea, B. An investigation into ion plating mechanisms and parameters. (Thesis). University of Salford, UK

• Thesis Type: Thesis
• Deposit Date: Jun 11, 2009
• Publicly Available Date: Jun 11, 2009
• Additional Information: Additional Information : PhD supervisor: Mr. D.G. Teer
• Award Date: Jan 1, 1978