W Lawson
Modeling and analysis of the growth of copper dendrites in saturated conditions using a multilevel factorial design analysis
Lawson, W; Pilkington, RD; Hill, AE
Authors
RD Pilkington
AE Hill
Abstract
Purpose – Tracks, pads and vias on printed circuit boards can suffer from a variety of problems, if the surfaces are contaminated with electricallyconducting substances. Aims to model a multilevel full-factorial design to study the effects of temperature, voltage and electrode gap on dendritic growth under saturated conditions, i.e. water droplet contamination.
Design/methodology/approach – Preparation of several DC-biased combed-copper interdigitated capacitors placed in temperature-controlled water-filled cuvettes enabled the specific monitoring of dendrite activity. The monitoring used the detection of sharp current increase that accompany a dendritic short circuit condition.
Findings – A high R2 polynomial model was produced and it was noted that increased voltages reduce the reliability impact of dendritic growth.
Originality/value – The paper focuses on the reliability impact dendritic growth in saturated conditions.
Citation
Lawson, W., Pilkington, R., & Hill, A. Modeling and analysis of the growth of copper dendrites in saturated conditions using a multilevel factorial design analysis. Microelectronics International, 24(2), 28-34. https://doi.org/10.1108/13565360710745575
Journal Article Type | Article |
---|---|
Deposit Date | Oct 22, 2007 |
Journal | Microelectronics International |
Print ISSN | 1356-5362 |
Publisher | Emerald |
Peer Reviewed | Peer Reviewed |
Volume | 24 |
Issue | 2 |
Pages | 28-34 |
DOI | https://doi.org/10.1108/13565360710745575 |
Publisher URL | http://dx.doi.org/10.1108/13565360710745575 |
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