Modeling and analysis of the growth of copper dendrites in saturated conditions using a multilevel factorial design analysis

Lawson, W; Pilkington, RD; Hill, AE

Abstract

Purpose – Tracks, pads and vias on printed circuit boards can suffer from a variety of problems, if the surfaces are contaminated with electricallyconducting substances. Aims to model a multilevel full-factorial design to study the effects of temperature, voltage and electrode gap on dendritic growth under saturated conditions, i.e. water droplet contamination.

Design/methodology/approach – Preparation of several DC-biased combed-copper interdigitated capacitors placed in temperature-controlled water-filled cuvettes enabled the specific monitoring of dendrite activity. The monitoring used the detection of sharp current increase that accompany a dendritic short circuit condition.

Findings – A high R2 polynomial model was produced and it was noted that increased voltages reduce the reliability impact of dendritic growth.

Originality/value – The paper focuses on the reliability impact dendritic growth in saturated conditions.

Citation

Lawson, W., Pilkington, R., & Hill, A. Modeling and analysis of the growth of copper dendrites in saturated conditions using a multilevel factorial design analysis. Microelectronics International, 24(2), 28-34. https://doi.org/10.1108/13565360710745575

• Journal Article Type: Article
• Deposit Date: Oct 22, 2007
• Journal: Microelectronics International
• Print ISSN: 1356-5362
• Publisher: Emerald
• Peer Reviewed: Peer Reviewed
• Volume: 24
• Issue: 2
• Pages: 28-34
• DOI: https://doi.org/10.1108/13565360710745575
• Publisher URL: http://dx.doi.org/10.1108/13565360710745575