Fully 3D printed flexible, conformal and multi-directional tactile sensor with integrated biomimetic and auxetic structure

Wei, Yuyang; Li, Bingqian; Domingos, Marco; Qian, Zhihui; Zhu, Yiming; Yan, Lingyun; Ren, Lei; Wei, Guowu

Abstract

Tactile sensors play a crucial role in the development of biologically inspired robotic prostheses, particularly in providing tactile feedback. However, existing sensing technology still falls short in terms of sensitivity under high pressure and adaptability to uneven working surfaces. Furthermore, the fabrication of tactile sensors often requires complex and expensive manufacturing processes, limiting their widespread application. Here we develop a conformal tactile sensor with improved sensing performance fabricated using an in-house 3D printing system. Our sensor detects shear stimuli through the integration of an auxetic structure and interlocking features. The design enables an extended sensing range (from 0.1 to 0.26 MPa) and provides sensitivity in both normal and shear directions, with values of 0.63 KPa−1 and 0.92 N−1, respectively. Additionally, the sensor is capable of detecting temperature variations within the range of 40−90 °C. To showcase the feasibility of our approach, we have printed the tactile sensor directly onto the fingertip of an anthropomorphic robotic hand, the proximal femur head, and lumbar vertebra. The results demonstrate the potential for achieving sensorimotor control and temperature sensing in artificial upper limbs, and allowing the monitoring of bone-on-bone load.

Citation

Wei, Y., Li, B., Domingos, M., Qian, Z., Zhu, Y., Yan, L., …Wei, G. (2023). Fully 3D printed flexible, conformal and multi-directional tactile sensor with integrated biomimetic and auxetic structure. #Journal not on list, 2(1), 80. https://doi.org/10.1038/s44172-023-00131-x

• Journal Article Type: Article
• Acceptance Date: Oct 30, 2023
• Online Publication Date: Nov 14, 2023
• Publication Date: 2023
• Deposit Date: Nov 22, 2023
• Publicly Available Date: Nov 22, 2023
• Journal: Communications Engineering
• Peer Reviewed: Peer Reviewed
• Volume: 2
• Issue: 1
• Pages: 80
• DOI: https://doi.org/10.1038/s44172-023-00131-x