Dr Ali Kadir A.Kadir@salford.ac.uk
Reader
Finite element thermal stress analysis of silicon chips
Kadir, Ali; Bég, Anwar; Oommen, Eric J; Bég, Tasveer A; Kuharat, Sireetorn; Hampson, Paul; Jouri, Walid
Authors
Prof Osman Beg O.A.Beg@salford.ac.uk
Professor
Eric J Oommen
Tasveer A Bég
Ms Sireetorn Kuharat S.Kuharat2@salford.ac.uk
Lecturer
Dr Paul Hampson P.R.Hampson1@salford.ac.uk
Lecturer
Walid Jouri
Citation
Kadir, A., Bég, A., Oommen, E. J., Bég, T. A., Kuharat, S., Hampson, P., & Jouri, W. (in press). Finite element thermal stress analysis of silicon chips.
| Conference Name | ICMEEM 2024: 18th International Conference on Mechanical Engineering, Energy and Materials |
|---|---|
| Conference Location | Bangkok, Thailand |
| Start Date | Aug 19, 2024 |
| End Date | Aug 20, 2024 |
| Acceptance Date | Sep 28, 2023 |
| Deposit Date | Sep 29, 2023 |
| Related Public URLs | https://waset.org/mechanical-engineering-energy-and-materials-conference-in-august-2024-in-bangkok |
This file is under embargo due to copyright reasons.
Contact O.A.Beg@salford.ac.uk to request a copy for personal use.
You might also like
Swirling bioconvective nanofluid flow from a spinning stretchable disk in a permeable medium
(2022)
Journal Article
Downloadable Citations
About USIR
Administrator e-mail: library-research@salford.ac.uk
This application uses the following open-source libraries:
SheetJS Community Edition
Apache License Version 2.0 (http://www.apache.org/licenses/)
PDF.js
Apache License Version 2.0 (http://www.apache.org/licenses/)
Font Awesome
SIL OFL 1.1 (http://scripts.sil.org/OFL)
MIT License (http://opensource.org/licenses/mit-license.html)
CC BY 3.0 ( http://creativecommons.org/licenses/by/3.0/)
Powered by Worktribe © 2024
Advanced Search