Dr Paul Hampson's Outputs (3)

Finite element thermal stress analysis of silicon chips (2023)
Conference Proceeding
Kadir, A., Bég, A., Oommen, E. J., Bég, T. A., Kuharat, S., Hampson, P., & Jouri, W. (in press). Finite element thermal stress analysis of silicon chips.

Functional graded material structural mechanics analysis of functional graded materials with applications in nanobeams and thermoelasticity of cylindrical shell rocket chamber structures (2023)
Conference Proceeding
Kadir, A., Anwar Bég, O., Bég, T. A., Kuharat, S., Jouri, W. S., Gorla, R. S. R., & Hampson, P. (in press). Functional graded material structural mechanics analysis of functional graded materials with applications in nanobeams and thermoelasticity of cylindrical shell rocket chamber structures.

Computational stress analysis of aluminium and polyethylene composites in marine vessel hull structures (2023)
Conference Proceeding
Jouri, W. S., Kungu, C., Kadir, A., Anwar Bég, O., Bég, T. A., Kuharat, S., …Hampson, P. (in press). Computational stress analysis of aluminium and polyethylene composites in marine vessel hull structures.